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At present, energy conservation, emission reduction and energy efficiency improvement are becoming an important means of practicing "green and low-carbon" production, and wide band gap semiconductor materials represented by silicon carbide and gallium nitride are also ushering in a period of rapid development. How to ensure the reliability of power devices? How to seize the commanding heights of emerging industries such as 5G communication, new energy vehicles, photovoltaic energy storage, and industrial automation? At the "27th Efficient Power Management and Power Device Forum" held in the same period of IIC Shanghai 2024, experts from the leading enterprises gave us answers.
At present, power devices represented by IGBT and the third generation wide bandgap semiconductors have been widely used in new energy vehicles, smart grids, rail transit, photovoltaic energy storage and other fields.
From a testing point of view, power semiconductor testing mainly includes dynamic parameters, static parameters, durability/reliability, and dual-pulse testing and other items,
but whether it is possible to cover wafer testing from low-voltage analog chips to high-voltage high-power SiC/GaN devices on one instrument, As well as the demand for new nanomaterials, photoelectric chips and sensors, which require high accuracy of current measurement, it is not a small challenge.
In this regard, the industry's first "6 in 1" source table SMU IT2800 series has made a useful attempt. According to the introduction of Chen Wenbing, technical manager of ITECH, the resolution of this series can reach up to 100nV/10fA,
the "source" and "table" are integrated, the large-size touch screen and the rich graphical display design UI interface can directly obtain the volt-amperage characteristic curve of semiconductor devices, and record the process data of products in real time, which is very convenient.
In the case of "power module power cycle test" cited by Chen Wenbing, we saw the IT6000 series. Taking IT6000C as an example, this is a bidirectional programmable DC power supply developed based on the third-generation SiC technology,
which can be rapidly and continuously switched between the output and absorbed current, effectively avoiding voltage or current overshooting, and is widely used in battery, battery packaging and battery protection board and other energy storage equipment testing.
In the "Smart power switch IPS aging test" case, the IT-M3300 low-power feedback electronic load played a key role. "At present, the minimum Power of the feedback load on the market is about 3.5kW, and the test cost is too high for the aging of the Power IC with several hundred watts.
However, the IT-M3300 feedback load has a high power density and a maximum power of 800W in a 1U volume, which is suitable for independent burn-in testing of IPS, and the feedback efficiency is up to 92%, saving enterprises electricity costs." Chen Wenbing said.
As the first chip company in China to focus on the field of reconfigurable digital power supply, Water core Electronics is committed to the research and development and industrialization of reconfigurable digital power supply chips,
to solve the problem of high-end power chip jams, and has profound technology accumulation and subversive technological innovation capabilities in the field of power supply and SOC.
The core advantage of reconfigurable digital power chip is the use of software-defined power chip, with a small number of models to achieve tens of millions of customer customized needs, without repeated chip development, flow sheet.
Unlike traditional software-based digital power chips, the chip is low cost and will even be cheaper than traditional analog power chips. At the same time, the reconfigurable digital power chip is a specially customized controller designed for the power supply,
rather than a general DSP, so it is simpler to use, powerful, low power consumption and small size.
Du Zhenyu, senior application engineer of Water core Electronics, pointed out that by using reconfigurable digital power chip technology to fully replace high-end high-power power chip,
the world's leading new topology control method has been rapidly fission, which has greatly promoted the development of the power industry. The highlight of the water core electronic solution is that it can reduce the power chip material number by a hundred times,
and realize the power chip platform and digital revolution.In order to ensure the high reliability of the product, the water core electronics start from two dimensions and three levels:
Production - inspection. Measures include: select through 16949 vehicle regulation certified production line to do IC production and processing; In wafer test and finished product test, select low temperature (-50°), normal temperature,
high temperature (150°) for 100% test; The execution of ORT, in the daily production process, regular (quarterly), quantitative (2KK) package reliability test.
Product consistency: mainly refers to the completion of the product from the earliest verification, the transfer of the test procedure to mass production, and the solidification of all process processes;
Hold regular (weekly, monthly) quality meetings with the factory around the wafer yield after mass production and the differentiation of bad items; Strictly implement the change management regulations, and specify the project terms that can be changed only with the consent of the customer.
M2025 is a typical representative of the water core DSP solution, integrated 80MHz ARM Cortex core, with high-performance 3P3Z loop compensation hardware accelerator, ADC PPB auxiliary processing function, CLB programmable function logic block and other key peripherals,
suitable for micro inverse, PCS, servers, electric vehicles and other industries.
Common important test items for power integrity include: power-on/power-off timing, ripple noise, PSRR(power rejection ratio), loop response testing, PDN impedance, and more. Song Guochao, product manager of oscilloscope in East China of Keisel Technology,
pointed out that from a measurement point of view, the challenge of power integrity measurement mainly comes from "measuring the smaller and faster AC signal on the DC power supply", so it is necessary to overcome the three major problems of the measurement system floor noise, bias and load effect.
"In many modern systems, higher bandwidth is required to detect high-frequency noise on the DC power supply, because the power supply noise is the main cause of clock/data jitter."
Song Guochao said that this shows that it is important to have enough bandwidth on the one hand, and on the other hand, it is necessary to weigh bandwidth restrictions from the actual demand.
Another factor that affects the integrity of the power supply comes from the probe, such as different probe types, probe ground length will affect the noise, in addition to considering the large DC signal bias caused by the difference between the probe bias and the DC blocker.
Song also shared some tips and tricks for power integrity measurement:
Choose the oscilloscope measurement path with low noise according to the situation
Try to use a probe with a low attenuation ratio if the voltage allows
Use the necessary amount of bandwidth
Sufficient bandwidth to capture high-frequency transients and noise
Probe ground length as short as possible
Take advantage of the bias function
Minimize load effects
Use FFT to get another analytical perspective
Trace the noise source by triggering and averaging
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